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About this Engineering article
Multi-level Particle Packing Model of Ceramic Agglomerates by Kim, Jong Cheol; Auh, Keun Ho; Martin, David M is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kim, Jong Cheol; Auh, Keun Ho; Martin, David M
- Publisher
- Institute of Physics; IOP Publishing; Institute of Physics Publishing (ISSN 0965-0393)
- Published
- 2000
- Field
- Engineering (Physical Sciences)
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