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Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed by Ramunas Tupciauskas, Zigmunds Orlovskis, Karlis Trevors Blums, Janis Liepins, Andris Berzins, Gunars Pavlovics & Martins Andzs is a book available to read on EtoBox.
- Author
- Ramunas Tupciauskas, Zigmunds Orlovskis, Karlis Trevors Blums, Janis Liepins, Andris Berzins, Gunars Pavlovics & Martins Andzs
- Language
- EN
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