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About this Engineering article
Quantification and Evaluation of System Grounding and Electric Bonding Performance by Hu, Xiao Dong; Li, Li; Tian, Jin is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hu, Xiao Dong; Li, Li; Tian, Jin
- Publisher
- Trans Tech Publications Inc.; Trans Tech Publications, Ltd.; Scitec Publications Ltd. (ISSN 1660-9336)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)