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About this Engineering article
Asymptotic thermal analysis of electronic packages and printed-circuit boards : Da-Guang Liu et al. IEEE Transactions on Components, Packaging and Manufacturing Technology—Part A, 18 (4), 781 (1995) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1997
- Language
- EN
- Field
- Engineering (Physical Sciences)