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Can I read Sn–0.7 wt.%Cu/Ni interfacial reactions at 250 °C on EtoBox?
Sn–0.7 wt.%Cu/Ni interfacial reactions at 250 °C by Chao-hong Wang; Sinn-wen Chen is a Engineering article available to read on EtoBox.
What is Sn–0.7 wt.%Cu/Ni interfacial reactions at 250 °C about?
Sn-0.7 wt.%Cu alloy is a promising Pb-free solder, and Ni is a commonly used barrier layer material. Sn-0.7 wt.%Cu/Ni couples are prepared and reacted at 250 °C. The interfacial reactions are examined, reaction mechanisms are proposed, and solder size effects upon the interfacial reactions are investigated. The Cu 6 Sn 5 phase forms and grows with longer reaction time in the initial stage. Then the Cu 6 Sn 5 phase layer fractures and part of the layer detaches. Microstructural analysis indicates that the detached and the attached layers have finer and larger grains, respectively, and the Cu 6 Sn 5 phase has a near hexagonal prism shape. The freshly exposed Cu 6 Sn 5 phase layer continues to grow and then the reaction layer thickness reaches a plateau. The Ni 3 Sn 4 phase forms and the Cu 6 Sn 5 phase layer disintegrates in the later stage of the reactions. The transition timing of the different stages is affected by the amounts of solder used.
Who reads Sn–0.7 wt.%Cu/Ni interfacial reactions at 250 °C?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chao-hong Wang; Sinn-wen Chen
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1359-6454)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)