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About this Materials Science article
Surface damage accumulation in Sn–Ag solder joints under large reversed strains by J. Howell; A. Telang; J. G. Lee; S. Choi; K. N. Subramanian is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- J. Howell; A. Telang; J. G. Lee; S. Choi; K. N. Subramanian
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2002
- Field
- Materials Science (Physical Sciences)
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