About this scholarly article

2009 59th Electronic Components and Technology Conference - 3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections by Khan, Navas; Hong Yu, ; Pin, Tan Siow; Ho, Soon Wee; Su, Nandar; Hnin, Wai Yin; Kripesh, Vaidyanathan; Lau, John H.; Chuan, Toh Kok is a scholarly article available to read on EtoBox.

Author

Khan, Navas; Hong Yu, ; Pin, Tan Siow; Ho, Soon Wee; Su, Nandar; Hnin, Wai Yin; Kripesh, Vaidyanathan; Lau, John H.; Chuan, Toh Kok

Publisher

IEEE

Published

2009

Language

EN