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About this Engineering article
Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150°C by Feller, L.; Hartmann, S.; Schneider, D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Feller, L.; Hartmann, S.; Schneider, D.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2008
- Language
- EN
- Field
- Engineering (Physical Sciences)