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About this Engineering article
Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal by Lee, Hyunseop; Lee, Sangjik is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lee, Hyunseop; Lee, Sangjik
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0141-6359)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)