About this scholarly article

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Low-temperature multichip-to-wafer 3D integration based on via-last TSV with OER-TEOS-CVD and microbump bonding without solder extrusion by Kumahara, Kousei; Liang, Rui; Lee, Sungho; Miwa, Yuki; Murugesan, Mariappan; Kino, Hisashi; Fukushima, Takafumi; Tanaka, Tetsu is a scholarly article available to read on EtoBox.

Author

Kumahara, Kousei; Liang, Rui; Lee, Sungho; Miwa, Yuki; Murugesan, Mariappan; Kino, Hisashi; Fukushima, Takafumi; Tanaka, Tetsu

Publisher

IEEE

Published

2020