About this scholarly article

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002. - Time and temperature dependent mechanical characterization of polymer-based materials in electronic packaging application by Chia-Tai Kuo, ; Ming-Chuen Yip, ; Kuo-Ning Chiang, ; Yi-Ming Jen, is a scholarly article available to read on EtoBox.

Author

Chia-Tai Kuo, ; Ming-Chuen Yip, ; Kuo-Ning Chiang, ; Yi-Ming Jen,

Publisher

IEEE

Published

2002