About this scholarly article

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability by Lau, D.; Lee, S.W.R. is a scholarly article available to read on EtoBox.

Author

Lau, D.; Lee, S.W.R.

Publisher

IEEE

Published

2004