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About this Engineering article
Adhesive Stabilised and Pure Flip Chips on Various Substrates Under Thermocycling by S. Rzepka; B. Waidhas; E. Meusel is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- S. Rzepka; B. Waidhas; E. Meusel
- Publisher
- Springer-Verlag; Springer Verlag; Springer Science and Business Media LLC (ISSN 0946-7076)
- Published
- 1995
- Language
- EN
- Field
- Engineering (Physical Sciences)