About this scholarly article

Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Reliability analyses for new improved high performance flip chip BGA packages by Chong, D.Y.R.; Goh, K.Y.; Kapoor, R.; Sun, A.Y.S. is a scholarly article available to read on EtoBox.

Author

Chong, D.Y.R.; Goh, K.Y.; Kapoor, R.; Sun, A.Y.S.

Publisher

IEEE

Published

2003

Language

EN