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About this Engineering article
Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test by Huang, Y.L.; Lin, K.L.; Liu, D.S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Huang, Y.L.; Lin, K.L.; Liu, D.S.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP); Research Square (ISSN 0884-2914)
- Published
- 2010
- Field
- Engineering (Physical Sciences)