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About this Engineering article
Interdiffusion in NiFe/Cu/NiFe trilayers: Possible failure mechanism for magnetoelectronic devices by Bruckner, W.; Baunack, S.; Hecker, M.; Monch, J.-I.; van Loyen, L.; Schneider, C. M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Bruckner, W.; Baunack, S.; Hecker, M.; Monch, J.-I.; van Loyen, L.; Schneider, C. M.
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2000
- Field
- Engineering (Physical Sciences)