Opening book details…
About this Engineering article
Reliability of Copper Through-Package Vias in Bare Glass Interposers by Demir, Kaya; Armutlulu, Andac; Sundaram, Venky; Raj, P. Markondeya; Tummala, Rao R. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Demir, Kaya; Armutlulu, Andac; Sundaram, Venky; Raj, P. Markondeya; Tummala, Rao R.
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2017
- Field
- Engineering (Physical Sciences)