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About this Engineering article
Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices by Yu, Li Ming (author);Sur, Bang Man (author);Pyo, Kim Young (author);Qing, Wang Chun (author);Lei, Zhang (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yu, Li Ming (author);Sur, Bang Man (author);Pyo, Kim Young (author);Qing, Wang Chun (author);Lei, Zhang (author)
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 2004
- Field
- Engineering (Physical Sciences)