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What is Thermal Modeling for Monolithic 3-D ICs about?

This paper presents a study on the thermal behavior of monolithic 3-D integrated circuits (ICs) compared to through silicon via-based 3-D ICs, highlighting the impact of interlayer dielectric on thermal coupling. It introduces a fast and accurate compact thermal analysis model that incorporates package structure, achieving a temperature evaluation error of less than 5%, and demonstrates significant temperature reduction with minimal area overhead. The research also explores the influence of material propert

Author

Shanthi Jeyabal

Language

EN