About this scholarly article

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications by Nguyen, Hoang-Vu; Do, Nu Bich Duyen; Aasmundtveit, Knut E. is a scholarly article available to read on EtoBox.

Author

Nguyen, Hoang-Vu; Do, Nu Bich Duyen; Aasmundtveit, Knut E.

Publisher

IEEE

Published

2017