About this scholarly article

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Blech effect in single-inlaid Cu interconnects by Thrasher, S.; Capasso, C.; Zhao, L.; Hernandez, R.; Mulski, P.; Rose, S.; Nguyen, T.; Kawasaki, H. is a scholarly article available to read on EtoBox.

Author

Thrasher, S.; Capasso, C.; Zhao, L.; Hernandez, R.; Mulski, P.; Rose, S.; Nguyen, T.; Kawasaki, H.

Publisher

IEEE

Published

2001