About this scholarly article

Intersociety Conference on Thermal Phenomena in Electronic Systems - Austin, TX, USA (5-8 Feb. 1992)] [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems - Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronics by Goodson, K.E.; Flik, M.I. is a scholarly article available to read on EtoBox.

Author

Goodson, K.E.; Flik, M.I.

Publisher

IEEE

Published

1992

Language

EN