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About this Engineering article
Improving Process Reliability by Means of Detection of Weld Seam Irregularities in Copper via Thermographic Process Monitoring by Schaumberger, K.; Beck, M.; Saffer, J.; Kaufmann, F.; Ermer, J.; Roth, S.; Schmidt, M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Schaumberger, K.; Beck, M.; Saffer, J.; Kaufmann, F.; Ermer, J.; Roth, S.; Schmidt, M.
- Publisher
- Elsevier ; Elsevier BV; Amsterdam: Elsevier B.V. (ISSN 2351-9789)
- Published
- 2019
- Language
- EN
- Field
- Engineering (Physical Sciences)