About this scholarly article

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process by Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan; Shen, Geng-Shin is a scholarly article available to read on EtoBox.

Author

Deng, Shang-Shiuan; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn-Yuan; Shen, Geng-Shin

Publisher

IEEE

Published

2010

Language

EN