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Structural Design and Research Progress of Thermally Conductive Polyimide Film – A Review by Kangkang Tao; Gaohui Sun; Chengcheng Feng; Guangmin Liu; Yahui Li; Rongrong Chen; Jun Wang; Shihui Han is a Materials Science article available to read on EtoBox.
What is Structural Design and Research Progress of Thermally Conductive Polyimide Film – A Review about?
Currently, heat accumulation has seriously affected stabilities and life of electronic devices.Polyimide (PI) film with high thermal conductivity coefficient (λ) has long been held up as an ideal solution for heat dissipation. Based on the thermal conduction mechanisms and classical thermal conduction models, this review presents design ideas of PI films with microscopically ordered liquid crystalline structure which are of great significance for breaking the limit of λ enhancement and describes the construction principles of thermal conduction network in high-λ filler strengthened PI films. Furtherly, the effects of filler type, thermal conduction paths and interfacial thermal resistances (ITR) on thermally conductive behavior of PI film are systematically reviewed.
Who reads Structural Design and Research Progress of Thermally Conductive Polyimide Film – A Review?
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Kangkang Tao; Gaohui Sun; Chengcheng Feng; Guangmin Liu; Yahui Li; Rongrong Chen; Jun Wang; Shihui Han
- Publisher
- Wiley
- Published
- 2023
- Language
- EN
- Field
- Materials Science (Physical Sciences)