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About this Engineering article
Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging by Krishna, Arvind; Harper, B. D.; Lee, J. K. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Krishna, Arvind; Harper, B. D.; Lee, J. K.
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 1043-7398)
- Published
- 1995
- Field
- Engineering (Physical Sciences)