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About this Engineering article
VIA-2 rapid direct writing of surface relief structures in silicon using laser photoetching by Ehrlich, D.J.; Osgood, R.M., Jr.; Deutsch, T.F. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Ehrlich, D.J.; Osgood, R.M., Jr.; Deutsch, T.F.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 1981
- Language
- EN
- Field
- Engineering (Physical Sciences)
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