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About this Engineering article
The Effect of Low Stresses on Creep and Surface Profiles of Thin Copper Wires by V Srivastava; K.R McNee; H Jones; G.W Greenwood is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- V Srivastava; K.R McNee; H Jones; G.W Greenwood
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 1359-6454)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)
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