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This study investigates the adhesion of electrodeposited copper, nickel, and silver films on their respective substrates using various tests and microscopy techniques. Results indicate that adhesion strength varies significantly among different film/substrate combinations, with strong adhesion observed in nickel film on copper substrate, while other combinations exhibit weak adhesion due to voids and lack of crystallographic coherency. The findings suggest that the adhesion of electrodeposited films is prim

Author

khowattanap

Language

EN