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About this Materials Science article
The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering by C.C. Chang; Y.W. Lin; Y.W. Wang; C.R. Kao is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- C.C. Chang; Y.W. Lin; Y.W. Wang; C.R. Kao
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2010
- Language
- EN
- Field
- Materials Science (Physical Sciences)
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