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This study focuses on the development of an immersion tin plating solution for printed circuit boards (PCBs) to enhance corrosion protection and solderability. The solution, which includes various chemical components, allows for the deposition of tin coatings that maintain their effectiveness for up to six months and prevents whisker formation. The research highlights the importance of temperature and additives like sodium hypophosphite and antioxidants in achieving optimal coating characteristics.

Author

Tanzil Zaidi

Language

EN