About this scholarly article

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Thermal simulation and validation of the fast static RAM 164-lead FC-PBGA package with investigations of package thermal performance in a generic CPU module by Eyman, M.; Johnson, Z.; Joiner, B. is a scholarly article available to read on EtoBox.

Author

Eyman, M.; Johnson, Z.; Joiner, B.

Publisher

IEEE

Published

1998

Language

EN