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Lead-Free Solder Paste Balling Study by prabuddhiwishmika is a document available to read on EtoBox.
This study investigates solder balling in Sn/Ag/Cu lead-free solder pastes, focusing on the effects of reflow profiles, stencil thickness, and particle size. Results indicate that the reflow atmosphere significantly impacts solder ball formation, with nitrogen reducing solder balls by up to 99%. Additionally, solder paste particle size and flux chemistry are crucial factors in determining the extent of solder balling during the reflow process.
- Author
- prabuddhiwishmika
- Language
- EN