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Superconducting Through-Silicon Vias for Quantum Integrated Circuits by Vahidpour, Mehrnoosh; O'Brien, William; Whyland, Jon Tyler; Angeles, Joel; Marshall, Jayss; Scarabelli, Diego; Crossman, Genya; Yadav, Kamal; Mohan, Yuvraj; Bui, Catvu; Rawat, Vijay; Renzas, Russ; Vodrahalli, Nagesh; Bestwick, Andrew; Rigetti, Chad is a scholarly article available to read on EtoBox.

What is Superconducting Through-Silicon Vias for Quantum Integrated Circuits about?

We describe a microfabrication process for superconducting through-silicon vias appropriate for use in superconducting qubit quantum processors. With a sloped-wall via geometry, we can use non-conformal metal deposition methods such as electron-beam evaporation and sputtering, which reliably deposit high quality superconducting films. Via superconductivity is validated by demonstrating zero via-to-via resistance below the critical temperature of aluminum.

Author

Vahidpour, Mehrnoosh; O'Brien, William; Whyland, Jon Tyler; Angeles, Joel; Marshall, Jayss; Scarabelli, Diego; Crossman, Genya; Yadav, Kamal; Mohan, Yuvraj; Bui, Catvu; Rawat, Vijay; Renzas, Russ; Vodrahalli, Nagesh; Bestwick, Andrew; Rigetti, Chad

Published

2017

Language

EN