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What is Thermal Conduction Model for TSV Interposer about?
This study presents an effective model for thermal conduction analysis in 2.5D packaging using Through Silicon Via (TSV) interposers. The model predicts effective thermal conductivity in both out-of-plane and in-plane directions, achieving over 95% accuracy compared to real models when the volume ratio of copper to silicon is below 10%. The findings emphasize the importance of thermal management in the design of 2.5D packages, particularly regarding the materials used in the package substrate and EMC.
- Author
- liuju025
- Language
- EN