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What is Semiconductor Failure Analysis Techniques about?
Failure analysis is the process of determining how and why a semiconductor device failed. It begins with verifying the failure and characterizing the failure mode. Non-destructive techniques like optical microscopy and x-ray are then used before destructive techniques. The results are analyzed to determine the failure mechanism, or physical cause. The objective is to identify the failure mechanism in order to prevent future failures and find the root cause. Various failure analysis techniques are used, incl
- Author
- labacahin
- Language
- EN