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About this Engineering article
A General Strategy of In-situ Warpage Characterization for Solder Attached Packages with Digital Image Correlation Method by Niu, Yuling; Wang, Huayan; Park, S.B. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Niu, Yuling; Wang, Huayan; Park, S.B.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0143-8166)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)