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About this scholarly article
1991 Proceedings Eighth International IEEE VLSI Multilevel Interconnection Conference - Thermal stability issues in copper based metallization by Jian Li, ; Shacham-Diamond, Y.; Mayer, J.W.; Colgan, E.G. is a scholarly article available to read on EtoBox.
- Author
- Jian Li, ; Shacham-Diamond, Y.; Mayer, J.W.; Colgan, E.G.
- Publisher
- IEEE
- Published
- 1991
- Language
- EN
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