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About this Engineering article
Grain-boundary Character and Grain Growth in Bulk Tin and Bulk Lead-free Solder Alloys by A. U. Telang; T. R. Bieler; J. P. Lucas; K. N. Subramanian; L. P. Lehman; Y. Xing; E. J. Cotts is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- A. U. Telang; T. R. Bieler; J. P. Lucas; K. N. Subramanian; L. P. Lehman; Y. Xing; E. J. Cotts
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 2004
- Field
- Engineering (Physical Sciences)