Opening book details…
About this Engineering article
Measurement of Adhesive Bond Properties Including Damage by Dynamic Mechanical Thermal Analysis of a Beam Specimen by Brinson, Hal F.; Dickie, Ray A.; Debolt, Michael A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Brinson, Hal F.; Dickie, Ray A.; Debolt, Michael A.
- Publisher
- Taylor and Francis Group; Informa UK (Taylor & Francis); Taylor & Francis; Informa UK Limited (ISSN 0021-8464)
- Published
- 1995
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by Brinson, Hal F.; Dickie, Ray A.; Debolt, Michael A.
Browse all works by Brinson, Hal F.; Dickie, Ray A.; Debolt, Michael A.