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Microalloying Effects SB Ag Microstructural Evolution Smta - 1 by Tanmoy Sadman is a document available to read on EtoBox.

This document discusses the microalloying effects of antimony (Sb) and silver (Ag) on the microstructural evolution of eutectic Sn-Bi alloys, which are low-temperature solders suitable for electronics packaging. The study highlights how these alloying additions can improve ductility and drop-shock performance while reducing strain-rate sensitivity, ultimately enhancing reliability in solder joints. The research aims to characterize microstructures and establish solubility limits for Sb and Ag in Sn-Bi solde

Author

Tanmoy Sadman

Language

EN