About this scholarly article

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature bonding with metallic micro-cones for 3D integration by Chen, Zhuo; Lu, Qin; Hang, Tao; Hu, Anmin; Li, Ming is a scholarly article available to read on EtoBox.

Author

Chen, Zhuo; Lu, Qin; Hang, Tao; Hu, Anmin; Li, Ming

Publisher

IEEE

Published

2012

Language

EN