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Thermal Stability of Copper Contact Metallization Using Ru-Containing Liner by Seo, S.-C.; Yang, C.-C.; Hu, C.-K.; Kerber, A.; Fan, S.; Horak, D.; Canaperi, D.; Papa Rao, S.; Haran, B.; Doris, B. is a Engineering article available to read on EtoBox.
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- Author
- Seo, S.-C.; Yang, C.-C.; Hu, C.-K.; Kerber, A.; Fan, S.; Horak, D.; Canaperi, D.; Papa Rao, S.; Haran, B.; Doris, B.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 1099-0062)
- Published
- 2011
- Field
- Engineering (Physical Sciences)