About this scholarly article

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Failure mechanism of smaller substrate bond pad size in flip chip technology by CheeKoang Chen, ; SeawLai Cheah, ; ToonYoon Ang, ; Kuljeet Singh, ; Earley, A.A. is a scholarly article available to read on EtoBox.

Author

CheeKoang Chen, ; SeawLai Cheah, ; ToonYoon Ang, ; Kuljeet Singh, ; Earley, A.A.

Publisher

IEEE

Published

2004