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About this Engineering article
System on Chip or System on Package by Tummala, R.R.; Madisetti, V.K. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Tummala, R.R.; Madisetti, V.K.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0740-7475)
- Published
- 1999
- Language
- EN
- Field
- Engineering (Physical Sciences)