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About this Engineering article
Flip-Chip Packaging for a Two-Dimensional Thermal Flow Sensor Using a Copper Pillar Bump Technology by Sun, Jian-Bo; Qin, Ming; Huang, Qing-An is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sun, Jian-Bo; Qin, Ming; Huang, Qing-An
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1530-437X)
- Published
- 2007
- Language
- EN
- Field
- Engineering (Physical Sciences)