About this scholarly article

2014 IEEE Applied Power Electronics Conference and Exposition - APEC 2014 - Thermal analysis of a submodule for modular multilevel converters by Wu Cong, M.; Avenas, Y.; Miscevic, M.; Wang, M.-X; Mitova, R.; Lavieville, J.-P; Lasserre, P. is a scholarly article available to read on EtoBox.

Author

Wu Cong, M.; Avenas, Y.; Miscevic, M.; Wang, M.-X; Mitova, R.; Lavieville, J.-P; Lasserre, P.

Publisher

IEEE

Published

2014

Language

EN