About this scholarly article

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Fast-cure liquid encapsulant for ICs by Homma, Y.; Fujiki, T.; Kobayashi, K.; Shirai, Y.; Akazawa, K. is a scholarly article available to read on EtoBox.

Author

Homma, Y.; Fujiki, T.; Kobayashi, K.; Shirai, Y.; Akazawa, K.

Publisher

IEEE

Published

1996

Language

EN