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About this Engineering article
Correction to: Study on Thermal Response of Adhesively Bonded Honeycomb Sandwich Structure in High Temperature by Yuan, Rongnan (author);Zhang, Yi (author);Qin, Yiren (author);Lu, Shouxiang (author) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yuan, Rongnan (author);Zhang, Yi (author);Qin, Yiren (author);Lu, Shouxiang (author)
- Publisher
- Springer Science and Business Media LLC
- Published
- 2022
- Field
- Engineering (Physical Sciences)