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Residual Stress Development During The Composite Patch Bonding Process: Measurement and Modeling by Iris Sousa is a document available to read on EtoBox.
This paper presents an experimental technique for monitoring residual stress development throughout the composite patch repair curing process. Process-induced strains and specimen warpage during a number of different cure cycles were measured for a simulated single-sided composite patch repair of an aluminum substrate. Models for adhesive cure rate and glass transition behavior of the patch adhesive resin (FM 300-1K) were combined with a simple bi-metallic strip model to predict specimen warpage and strain
- Author
- Iris Sousa
- Language
- EN